Supersedes IPC/JEDEC J-STD .. Mass Reflow This standard applies to bulk solder reflow assembly by convection, convection/IR. Joint IPC/JEDEC Standard J-STD Page 1. STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW. SENSITIVE SURFACE. J-STDD. – Published August – Typos corrected 3/08 (Rev D.1). • J- STD – Published August • J-STDC. – Balloted within JEDEC & IPC.

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If the actual shelf life has exceeded 12 months, but less than 2 years, from the bag seal date and the humidity indicator card HIC see Clause 5.

All testing occurs inside the chamber, while the cards are exposed to the test humidity. Special consideration should be given to non-hermetic cavity packages. Floor-life derating is discussed in Clause 7. If bake iedec interrupted for greater than 15 minutes the total time of the interruption should be added to the bake time. C If blank, see adjacent j-td-033b.1 code label 3.

Drying per an allowable option resets the?

J-STD Bake Conditions

Table is based on worst-case molded lead frame SMD packages. Other color schemes may be used. Cards with spots that do not indicate dry or wet conditions, per Tableshould be rejected. The caution label includes? Refer to Figure A Although the body temperature during re? These methods are provided to j-std-033b.1 damage from moisture absorption and exposure to solder re?


In most cases it is applicable to other nonhermetic surface mount SMD packages. Spots without printing shall be tested. While the ipf members of the Joint Moisture Classi?

The cards inside the chamber must be observable from outside the chamber. If the calculated shelf life is greater than 12 months, item 1 of the caution label should be changed accordingly. Requirement, paragraph number Test Method numberparagraph number The referenced paragraph number has proven to j-std-0333b.1 After bag is opened, devices that will be subjected to reflow solder or other high temperature process must be a Mounted within: This can be accomplished by dry pack according to Clause 3.

The supplier shall formally communicate to the distributor the maximum ipcc that the product may be left unsealed at the distributor before rebaking is required.

Non-semiconductor devices may exhibit additional process sensitivities beyond moisture sensitivity such as thermal sensitivity,? An equivalency evaluation is recommended to ensure that high temperature processing maintains moisture weight gain to an acceptable level. The following conditions apply regardless of the storage time i. Hue shall be tested using the test method in Appendix A.


The caution j-ztd-033b.1 is not required if a bar code label includes the Level 1 classi?


All comments will be collected and dispersed to the appropriate committee s. Humidity conditions can be achieved by placing combinations of molecular sieve desiccant, glycerin, and water inside the chamber.

Allow the cards to condition for a minimum of 24 hours. Witness cards may be available from the HIC manufacturer if needed to con?

Light air evacuation j-std-033b.1 be used to reduce the packaging bulk and enhance carton packing Figure No moisture-absorbing material e.

A solution for addressing this problem is to derate the exposure times based on the knowledge of moisture diffusion in the component packaging materials refer to JESDA This will reset the?

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