IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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Don’t have an account? It should be noted ueee a reduction and simplification in thermal resistances is realized in the embodiment illustrated in FIG. Wedgelock device for increased thermal conductivity of a printed wiring assembly. Predictions using standard thermal analysis software were preformed to measure the expected improvements with the various embodiments of the adapter frame.

Affiliation List of ICS codes.

Conduction cooled CompactPCI boards ready for insertion

The net effect of these improvements are a reduction in the thermal resistance per inch of wedgelock length. By Clarence Peckham Conduction cooling of circuit cards is a technology that has been used for many years in the military marketplace. These items are replaced with the adapter of the present invention to increase the surface area contract between the cold wall of the chassis and the strip keee contact with card idee without impacting the COTS design.

Please create a new list with a new name; move some items to a new or existing list; or delete some items. Once this specification was available conduction cooled boards from different manufacturers could be used in the same system with no mechanical fit issues.

The novel features of the present invention will become apparent to those of skill in the art upon examination of the following detailed description of the invention or can be learned by practice of the present invention. More information add to basket.


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Sensitive and rapid method for detection of low levels of LAL-reactive substances. Electronic books Material Type: Caution the offer 1 user is reserved for a single user, any broadcast even within his company is prohibited. Optionally, heatsink 9 and frame 1 can be constructed from one piece of material.

Please choose whether or not you want other users to be able to see on your profile that this library is a favorite of yours. A plurality of electrical components 6 e. As clamping force is increased, the interface conductance is increased, thus increasing the efficiency of heat movement from the component 6 to the cold wall of chassis 2.

Citations are based on reference standards. High-performance synchronous bit bus: The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG. As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by from about 0.

In the embodiment of FIG. The name field is required. The system shown in Figure 1 contains up to six 3U VME cards and is capable of withstanding an ambient temperature of to 85 degrees C as well as a large shock and vibration environment. A card guide 18 is attached to the convection-cooled chassis 12 with for example, screws, for receiving the card 7 by its protrusion 4.

Conduction-Cooled PMC (CCPMC)

Conduction cooling allows the circuit boards to be sealed in the systems enclosure without requiring airflow. Advanced Search Find a Library. Wedge lock for use with a single board computer, a single board computer, and method of assembling a computer system. Once adapted, however, the COTS module is not backwards compatible with the convection-cooled type racks.

It is contemplated that the use of the present invention can involve components having different characteristics as long as the principle is followed, i. Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present in, for example, the military environment.


Certification of persons Do recognize your skills, register online to become certified. An improvement to an existing commercial off-the-shelf COTS circuit card module cooperating with a conduction-cooled chassis that receives the circuit card module resulting in increased cooling efficiency, the circuit card module having at least one printed wiring board PWBthe PWB having a protrusion at one end thereof, at least one component operatively connected to the PWB, a heat path between the component and the chassis, and a frame in contact with the PWB for stiffening the PWB, the improvement comprising:.

Similar to the embodiment of FIG. Your request to send this item has been completed.

The following summary of the invention is provided to facilitate an understanding of some of the innovative features unique to the present invention, and is not intended to be a full description.

Additionally, for IEEE The circuit card module of claim 1wherein said frame extension comprises an integrated frame extension with the frame. CA CAA1 en The remaining structure of keee circuit card module in FIG.

But the driving force has been a standard developed by the IEEE. Get a quote for certification of systems, products or services, and get certified. Some features of WorldCat will not be available.

The circuit card module comprises a frame 21which includes a protrusion 14 that fits in the card guide 18 of the chassis 12 as shown. Device for increased thermal conductivity between a printed wiring assembly and a chassis.

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